Chips&Media Joins TSMC's Soft-IP Alliance Program

Seoul, Korea. – October 12, 2010 - Chips&Media, Inc., a leader in silicon video Intellectual Property (IP), today announces that it has joined the newly announced TSMC Soft-IP Alliance Program included in TSMC’s Open Innovation Platform™, as a soft-IP core provider.

Chips&Media can deliver power, performance, and area-optimized IP for video processing through the program, in which TSMC is expected to provide specific technical information including standard cell libraries across TSMC technology nodes. Chips&Media will also help SoC customers to create value-added products with the ultimate aim of significantly reducing development time, cost, and risk.

“Chips&Media is pleased to enter the TSMC soft-IP Alliance Program to contribute next-generation video codec technology,” says Mr. Steve Kim, president, and CEO of Chips&Media, Inc. “We have led video IP industry with a wide range of differentiated video solutions for cost-sensitive, battery-powered devices including wireless, portable computing, advanced set-top-boxes, and network-enabled applications, and through the TSMC Alliance Program we will be able to broaden our customer base as well as strengthen our product portfolio with TSMC’s advanced process technology roadmap.”